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用电子显微镜揭示块共聚物的3D结构:当前状态和未来方向

Inbal Weisbord¹, Tamar Segal-Peretz¹

¹Chemical Engineering Department, Technion-Israel Institute of Technology, Haifa 3200003, Israel.

ACS applied materials & interfaces

|June 20, 2023

概括

块共聚合物 (BCP) 自组装是软物质应用的关键. 电子显微镜 (EM) 技术,包括断层扫描,对于理解BCP 3D结构和推进其使用至关重要.

科学领域:

软物质物理学软物质物理学
材料科学材料科学材料科学
纳米技术纳米技术

背景情况:

块共聚合物 (BCP) 是软物质自组装的模型系统.
它们的可调节纳米结构对于各种应用至关重要.
了解BCP的3D结构对于控制自组装至关重要.

研究的目的:

审查和比较3D电子显微镜 (EM) 方法来表征块共聚合物纳米结构.
讨论使用EM的BCP3D表征的挑战和解决方案.
突出新兴的EM技术,以推进BCP研究.

主要方法:

传输电子显微镜 (TEM) 断层扫描.传输电子显微镜.
切片和视图扫描电子显微镜 (SEM) 断层扫描.
讨论样品制备和对辐射敏感材料的成像.

主要成果:

对于BCP的TEM和SEM断层扫描的详细原则,优点和弱点.
克服BCP 3D EM表征方面的挑战的策略.
识别先进的电磁技术,如直接电子探测器和能量分散式X射线光谱学.

结论:

对于理解BCP自组装,3D EM方法是必不可少的.
克服样本准备和辐射敏感度至关重要.
新兴的新兴市场技术有望显著提高未来的BCP研究.

关键词:

这就是SEM SEM.这就是TEMEM.区块共聚合物区块共聚合物电子显微镜的电子显微镜自动组装的自动组装机扫描断层扫描 (tomography) 是一个非常重要的技术.

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