AlGaN HEMT 结构生长在错误切割 Si ((111) 晶圆上
Alexei V Sakharov1,2, Dmitri S Arteev2, Evgenii E Zavarin1,2
1Submicron Heterostructures for Microelectronics, Research and Engineering Center, RAS, 26 Politekhnicheskaya, 194021 Saint-Petersburg, Russia.
Materials (Basel, Switzerland)
|June 28, 2023
概括
基板误差显著影响AlGaN/GaN晶体管的性能. 优化晶片误导可以提高二维电子气体的流动性,而接口粗度是一个关键因素.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 设备工程 设备工程
背景情况:
- 化/化 (AlGaN/GaN) 高电子流动性晶体管 (HEMT) 对于高功率和高频应用至关重要.
- 基质特性,特别是切割误差的方向,可以影响表轴生长和设备性能.
- 了解这些影响对于优化HEMT制造至关重要.
研究的目的:
- 为了研究基质错误切割对AlGaN/GaN HEMT结构的影响.
- 为了确定最佳的误切角度,以增强设备属性.
- 确定影响二维电子气体流动性的主要因素.
主要方法:
- 在使用金属有机蒸汽相表 (MOVPE) 的错误切割Si(111) 晶圆上,AlGaN/GaN HEMT的表轴生长.
- 对菌株演变,表面形态和二维电子气体流动性的分析.
- 数值分析以将接口特性与电子移动性相关联.
主要成果:
- 晶圆误导会影响菌株的进化和生长过程中的表面形态.
- 在0.5°误撞角度观察到2D电子气体流动性的微弱最佳.
- 数字分析确定了接口粗度是影响电子移动性变化的主要因素.
结论:
- 基质误差是影响AlGaN/GaN HEMT特性的一个关键参数.
- 优化基质误差可以提高HEMT中的电子移动性.
- 接口粗度在确定电子移动性方面发挥着重要作用,指导未来的材料优化工作.
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