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在合机械压缩和热循环试验条件下,板级翻转芯片组件的可靠性评估
Meng-Kai Shih1, Yu-Hao Liu1, Calvin Lee2
1Department of Mechanical and Computer-Aided Engineering, National Formosa University, Huwei, Yulin 632, Taiwan.
Materials (Basel, Switzerland)
|June 28, 2023
概括
将散热器添加到片球网格阵列 (FCBGA) 包中可以降低可靠性. 这项研究表明,散热器和较长的加载距离增加了球爬行应变能量密度,降低了高性能计算应用中的性能.
科学领域:
- 材料科学与工程 材料科学与工程
- 机械工程 机械工程
- 可靠性工程可靠性工程
背景情况:
- 翻转芯片球网格阵列 (FCBGA) 包对于高I/O密度和高性能计算至关重要.
- 外部散热器可以改善散热,但会对接关节的可靠性产生负面影响.
- 了解这些权衡对于先进的电子包装至关重要.
研究的目的:
- 为了研究散热器对无盖式车载FCBGA包的接接头可靠性的影响.
- 分析散热器存在和加载距离对热循环下可靠性的影响.
- 为优化高性能电子包的设计提供洞察力.
主要方法:
- 构建FCBGA包的三维 (3D) 数值模型.
- 模拟热循环测试条件 (JEDEC标准测试条件G:-40至125°C).
- 使用从影子moiré系统的实验曲面测量对数值模型的验证.
主要成果:
- 数值模型准确地预测了FCBGA包曲面,证实了它的有效性.
- 发现添加散热器可以增加接球爬行应变能量密度 (CSED).
- 更长的装载距离也导致了CSED的增加,对可靠性产生了负面影响.
结论:
- 散热器虽然有利于热管理,但显著降低了FCBGA包的板级热循环可靠性.
- 增加接关节不弹性应变能量密度是可靠性降低的主要机制.
- 对于散热器和加载距离的设计考虑对于确保高性能计算包的长期可靠性至关重要.
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