通过应用HfO2作为AlGaN/GaN高电子流动性晶体管中被动化的增强操作特性:模拟研究
Jun-Hyeok Choi1, Woo-Seok Kang1, Dohyung Kim1
1Division of Electronics and Electrical Engineering, Dongguk University-Seoul, Seoul 04620, Republic of Korea.
Micromachines
|June 28, 2023
概括
这项研究使用混合被动化优化了AlGaN/GaN高电子移动性晶体管 (HEMT). 一个新的HfO2 / Si3N4结构改善了故障电压并保持了无线电频率 (RF) 性能,增强了约翰逊的性能.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体设备物理 半导体设备物理
- 电气工程 电气工程
背景情况:
- 化/化 (AlGaN/GaN) 高电子流动性晶体管 (HEMT) 对于高功率和高频应用至关重要.
- 消极化层对于保护HEMT和改善其操作特性至关重要.
- 传统的化 (Si3N4) 被动化具有局限性,需要探索替代或混合方法.
研究的目的:
- 研究二氧化物 (HfO2) 作为一种被动化层对AlGaN/GaN HEMTs的影响.
- 为了比较HEMT与Si3N4,HfO2和混合HfO2/Si3N4被动化结构的操作特性.
- 优化混合被动化结构,以提高故障电压和射频 (RF) 性能.
主要方法:
- 具有不同的被动化层 (Si3N4,HfO2,混合HfO2/Si3N4) 的AlGaN/GaN HEMT的设备制造和表征.
- 从Si3N4-被动化HEMT的测量数据中推导建模参数,以提高模拟可靠性.
- 对各种被动化方案的故障电压,频率特征和约翰逊功率 (JFM) 的系统分析和比较.
主要成果:
- 只有HfO2的被动化使断裂电压提高了19%,但降低了射频特性.
- 一个混合HfO2/Si3N4结构与优化Si3N4厚度 (350nm) 增强了15%的故障电压.
- 优化的混合结构保持了射频性能,导致JFM与基本Si3N4被动化相比提高了5%.
结论:
- 使用HfO2和Si3N4的混合被动化提供了一种有前途的方法,可以同时提高AlGaN/GaN HEMTs中的断裂电压和射频性能.
- 在混合结构中优化被动化层的厚度对于实现所需的设备特性至关重要.
- 开发的混合被动化战略为下一代高性能电子设备提供了一条道路.
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