相关实验视频

Updated: Jul 25, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

系统包装技术的审查:先进包装的应用和可靠性

Haoyu Wang¹, Jianshe Ma¹, Yide Yang¹

¹Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China.

|June 28, 2023

概括

系统包装 (SiP) 技术为先进的集成电路 (IC) 提供了集成和高密度. 本综述涵盖了SiP的创新,应用和可靠性因素,如热管理和机械应力.

科学领域:

材料科学材料科学材料科学
电气工程电气工程
计算机工程计算机工程

背景情况:

系统包装 (SiP) 技术对于集成电路 (IC) 进步至关重要.
SiP在集成,小型化和高密度方面具有优势.
市场需求推动了SiP开发的快速创新.

研究的目的:

审查SiP技术中的最新创新.
讨论SiP在各个领域的多样化应用.
识别和解决SiP设计中的关键可靠性挑战.

主要方法:

对最近的SiP创新和市场趋势的文献综述.
分析不同行业的SiP应用.
检查可靠性因素,包括热管理,机械应力和电气性能.

主要成果:

识别最新的市场驱动的SiP创新.
在各种技术领域的SiP集成的概述.
详细分析影响SiP可靠性的因素.

结论:

对于下一代IC来说,SiP技术至关重要.
解决可靠性问题对于SiP正常运行至关重要.
需要进一步的研究和开发来克服SiP的挑战,并释放未来的潜力.

关键词:

先进的包装,先进的包装.集成电路的集成电路.优化的优化优化优化.包装可靠性包装可靠性系统包装中的系统.

更多相关视频

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Published on: April 13, 2016

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

相关概念视频

Semiconductors

Semiconductors

There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...