AlGaN/GaN金属氧化物半导体高电子移动性晶体管与化TiO2作为被动和介电层
Yu-Shyan Lin1,2, Chi-Che Lu1
1Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974301, Taiwan.
Micromachines
|June 28, 2023
概括
改进的氧化/氧化 (AlGaN/GaN) 金属氧化物半导体高电子流动性晶体管 (MOS-HEMT) 使用二氧化 (TiO2) 介电层. 火增强了设备的性能和稳定性在高温下.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电气工程 电气工程
背景情况:
- 化/化 (AlGaN/GaN) 高电子流动性晶体管 (HEMT) 对于高功率和高频应用至关重要.
- 增强门介电和被动化层是提高设备性能和可靠性的关键.
- 二氧化 (TiO2) 具有作为AlGaN/GaN MOS-HEMTs的介电材料的潜力.
研究的目的:
- 研究TiO2作为AlGaN/GaN MOS-HEMT中的介电和被动化层的使用.
- 通过回火优化TiO2膜质量和设备性能.
- 为了评估退火对门泄漏电流,高温稳定性和输出功率的影响.
主要方法:
- 使用TiO2门介电和被动化的AlGaN/GaN MOS-HEMT的制造.
- 使用X射线光发射光谱学 (XPS),拉曼光谱学和传输电子显微镜 (TEM) 进行TiO2膜的表征.
- 在N2大气中在300°C时对MOS结构进行化处理.
主要成果:
- 在N2中在300°C的火显著提高了TiO2门氧化物的质量.
- 化MOS结构表明,大门泄漏电流的大幅减少.
- 制造的MOS-HEMT表现出高性能和稳定的运行,最高可达450K.
- 火导致设备的输出功率特性得到改善.
结论:
- 在AlGaN/GaN MOS-HEMTs中,TiO2是门介电和被动化的可行材料.
- 化是一种有效的方法来提高TiO2膜的质量和提高设备性能.
- 优化的AlGaN/GaN MOS-HEMT显示出对高功率和高温应用的希望.
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