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聚合物内部微尺度损伤的非破坏性3D成像 - 基于电场诱导的自我激发光效应的发现

Wenxia Sima¹, Xinyu Tang¹, Potao Sun¹

¹State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, 400044, China.

Advanced science (Weinheim, Baden-Wurttemberg, Germany)

|June 29, 2023

概括

一种新的光成像技术在3D中非破坏性地可视化了内部聚合物损伤. 这种方法克服了微CT的局限性,使材料中微尺度缺陷的现场精确分析成为可能.

科学领域:

材料科学材料科学材料科学
聚合物科学聚合物科学
图像技术技术的成像技术

背景情况:

微尺度聚合物损伤的高精度,非破坏性,三维 (3D) 现场成像仍然是一个重大挑战.
现有的微型计算机断层扫描 (micro-CT) 方法可能会造成不可逆转的材料损伤,并且不适合弹性材料.

研究的目的:

开发一种新的,高精度的,非破坏性的3D现场成像技术,用于内部聚合物损伤.
克服当前对弹性材料的成像技术的局限性.

主要方法:

研究了在应用电场下的凝中的电树诱导的自我激发的光效应.
开发并应用光显微镜成像方法,以在现场观察聚合物损伤.

主要成果:

成功实现了高精度,非破坏性,3D现场光成像聚合物损伤.
证明光成像方法允许体内切片和精确定位受损区域.
该技术对凝和潜在的其他弹性材料有效.

结论:

开创了一种新的光成像方法,用于对内部聚合物损伤进行非破坏性3D现场分析.
这种方法为绝缘材料和精密仪器中的成像缺陷提供了重大进步.
为了解材料降解提供了一个精确而无损的解决方案.

关键词:

3D重建的重建是3D重建.电气树电气树的树光自我激发的自我激发.非破坏性的成像成像.凝是一种凝.

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