在HfO基于模拟内存与薄SiO屏障层之间的逐渐设置和开/关比之间的权衡
Fabia F Athena1, Matthew P West2, Jinho Hah2
1School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.
概括
将屏障层添加到基于HfO2的突触器件中,可以在设置操作期间改善阻力控制. 然而,这种修改导致开/关比降低,影响模拟内存应用程序.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 计算机工程 计算机工程
背景情况:
- 基于氧化 (HfO2) 的突触对内存和神经形态计算具有前景.
- 这些设备中的电阻切换依赖于氧气空位的运动,通常会出现突然的变化,限制模拟内存的使用.
研究的目的:
- 研究插入AlO2或SiO2屏障层对基于HfO2的突触的电阻切换特征的影响.
- 为了改善HfO2突触的受控电阻变化,以获得更好的模拟内存性能.
主要方法:
- 制造基于HfO2的突触装置,在底部电极/氧化物接口上有或没有AlO2或SiO2屏障层.
- 电气特征分析电阻切换行为,重点关注设置操作和开/关比.
- 有限元建模,以了解屏障层对氧空位迁移和导电丝断裂的影响.
主要成果:
- 与裸体HfO2设备相比,HfO2/SiO2设备在设置操作期间表现出更受控的电阻变化.
- HfO2/SiO2设备的开/关比 (约为10) 低于HfO2/AlO2和HfO2设备的开/关比.
- 有限元素建模表明,HfO2/SiO2设备中较慢的氧空位迁移导致更窄的丝破裂区域,导致较低的高电阻状态和降低开/关比.
结论:
- 在基于HfO2的突触中使用屏障层减缓氧空位迁移,可以在设置操作期间增强控制.
- 改进设置控制的权衡是降低整体开/关比,这需要考虑模拟内存应用.
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