在SOI LDMOS中通过使用步骤P型兴奋剂埋藏层进行过渡性分解电压增强的数值调查
Xiaoming Yang1, Taiqiang Cao1, Xiaohua Zhang2
1School of Electrical Engineering and Electronic Information, Xihua University, Chengdu 610039, China.
Micromachines
|July 8, 2023
概括
一个新的步骤P型兴奋剂埋藏层 (SPBL) 显著提高了在绝缘体 (SOI) LDMOS设备的短暂故障电压 (TrBV) 和关机时间. 这种SPBL还可以降低特定的启动阻力 (R_on,sp),提高设备的整体性能.
科学领域:
- 半导体设备物理学 半导体设备物理
- 动力电子产品的动力电子.
- 材料科学是一种材料科学.
背景情况:
- 在电源应用中,在绝缘体 (SOI) 横向扩散金属氧化物半导体 (LDMOS) 设备至关重要.
- 改善故障电压和降低电阻是LDMOS设备设计的关键挑战.
- 减少表面场 (RESURF) 效应是影响分解特性的关键因素.
研究的目的:
- 为了研究阶段P型兴奋剂埋层 (SPBL) 对SOI LDMOS设备的短暂断裂电压 (TrBV) 的影响.
- 分析SPBL如何影响电气特性,包括故障电压,电阻和非故障时间.
- 为了比较SPBL SOI LDMOS与传统SOI LDMOS和双 RESURF SOI LDMOS的性能.
主要方法:
- 使用MEDICI 0.13.2软件进行了设备模拟.
- 在SOI LDMOS结构中,在埋藏氧化物 (BOX) 下面引入了一个步骤P类型的兴奋剂埋藏层 (SPBL).
- 模拟和分析了诸如横向和垂直故障电压,特定启动电阻和关机非故障时间等电气特性.
主要成果:
- SPBL增强了 RESURF 效应,导致侧面电场的分布更加均,并增加了侧面断裂电压 (BV_lat).
- 与标准SOI LDMOS相比,模拟显示SPBL SOI LDMOS的TrBV高出14.46%,特定上电阻 (R_on,sp) 低出46.25%.
- SPBL SOI LDMOS显示了65.64%的更长的非故障关机时间 (T_nonbv) 和更好的垂直故障电压 (BV_ver).
结论:
- 引入SPBL是一种有效的策略,可以增强TrBV并抑制SOI LDMOS设备中的R_on,sp.
- SPBL优化了电场分布,改善了横向和垂直断裂特性.
- 与传统的SOI LDMOS和双 RESURF SOI LDMOS相比,SPBL SOI LDMOS表现出了更高的性能.
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