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激光研磨链的参数优化,用于处理2.5维C/SiC复合材料的槽
Guoyue Liu1,2, Jian Wang1, Bing Chen1,2
1Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material, School of Mechanical Engineering, Hunan University of Science and Technology, Xiangtan 411201, China.
Materials (Basel, Switzerland)
|July 14, 2023
概括
一种新的激光研磨链方法提高了C/SiC复合材料槽加工. 这种综合方法实现了高效率和精度,大大提高了槽质量,与传统研磨相比缩短了加工时间.
科学领域:
- 材料科学与工程 材料科学与工程
- 制造过程 制造过程 制造过程
背景情况:
- 碳纤维增强碳化 (C/SiC) 复合材料存在加工挑战,原因是激光切除的精度差,研磨效率低.
- 现有的方法遭受了大量的磨轮磨损,影响了整体工艺的可行性.
研究的目的:
- 开发和优化C/SiC复合槽的联合激光研磨链加工方法.
- 研究激光和研磨参数对槽质量和加工效率的影响.
主要方法:
- 研究了激光处理参数 (功率,速度,频率,间距) 和废除槽特征之间的关系.
- 优化了激光参数,以达到可接受的准确性初始沟形成.
- 进行了进一步的研磨参数优化 (切割深度,轮速,料速度) 以提高槽质量.
主要成果:
- 激光处理使得材料能够快速移除,并形成具有良好的尺寸精度的沟.
- 优化的激光参数导致了带有改进但仍然不完美的侧墙倾斜度和表面表面的槽.
- 随后的研磨显著提高了槽尺寸精度,形状精度和表面质量.
结论:
- 综合激光研磨链加工方法有效地解决了C/SiC复合材料单个激光切除和研磨技术的局限性.
- 优化的参数 (例如,80W激光功率,300mm/s扫描速度,30μm切割深度) 实现了与单纯研磨相比,处理时间的23/40缩短.
- 这种综合方法为高效,高精度的C/SiC复合槽制造提供了可行的解决方案.
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