缓冲层类型对在PVD过程中沉积在复合织基板上的金属层电气性能的影响
Marcin Lebioda1, Ewa Korzeniewska1
1Institute of Electrical Engineering Systems, Lodz University of Technology, Stefanowskiego 18, 90-537 Lodz, Poland.
Materials (Basel, Switzerland)
|July 14, 2023
概括
织复合材料中的聚氨缓冲层在加热时显著改变表面电阻,影响可穿戴电子产品. 这种在自热和外部加热模式中观察到的效应,需要对稳定的导电结构进行仔细的材料选择.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 织技术 织技术 织技术
背景情况:
- 用于可穿戴应用的电子系统的小型化需要在织基板上稳定的导电结构.
- 选择合适的织基板对于保持织设备中电气参数的稳定性至关重要.
- 缓冲层对于在织复合材料中创建连续电导率至关重要.
研究的目的:
- 为了研究基板加热对通过物理真空种植产生的导电结构的表面电阻的影响.
- 为了评估不同缓冲层的织复合材料在热应力下电参数的稳定性.
- 为了确定聚氨,特和烯酸缓冲层对织结构阻力的影响.
主要方法:
- 使用聚氨,特和烯酸缓冲层的织复合材料作为基板.
- 使用物理真空种植生产了导电结构.
- 在自我加热和外部加热条件下测量了结构的表面电阻.
- 专门分析了将聚氨缓冲层加热到室温以上15°C的效果.
主要成果:
- 带有聚氨缓冲层的织基板在加热时表现出表面电阻的显著变化 (9-23%在自热,8-16%在外部加热).
- 这些电阻变化发生不论用于导电结构的金属.
- 在带有特龙或烯酸缓冲层的复合材料中没有观察到显著的电阻变化.
- 在聚氨层中观察到的现象在自加热和外部加热方法中一致.
结论:
- 织复合材料中的聚氨缓冲层容易受到温度诱导的表面电阻变化的影响.
- 在设计可穿戴电子产品的织结构时,必须考虑聚氨层的热敏度.
- 与聚氨相比,烯酸和烯酸缓冲层在热变化下在电气参数方面提供了更大的稳定性.
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