层空隙损坏对IGBT模块温度的影响
Pengpeng Xu1, Peisheng Liu1, Lei Yan1
1Jiangsu Key Laboratory of ASIC Design, Nantong University, Nantong 226019, China.
Micromachines
|July 29, 2023
概括
功率半导体设备中的接空隙显著增加了工作温度. 优化空隙大小,位置和使用纳米银糊可以提高热稳定性和设备可靠性.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 热管理 热管理
背景情况:
- 层空隙是功率半导体设备的关键故障机制,影响整体可靠性.
- 了解这些空隙的热效应对于提高设备性能和寿命至关重要.
研究的目的:
- 研究空格特征 (尺寸,位置,形状,分布) 对绝缘门双极晶体管 (IGBT) 模块的热性能的影响.
- 为了评估纳米银糊在缓解真空引起的热问题方面的有效性.
- 分析接层厚度与模块温度之间的关系.
主要方法:
- 使用DesignModeler开发了一个IGBT包装的3D模型.
- 使用ANSYS Workbench进行了有限元分析 (FEA),以模拟各种空气条件下的温度分布.
- 进行了对空隙大小,位置,类型和层厚度的参数研究.
主要成果:
- 增加的空隙半径和接近层中心导致IGBT模块温度更高.
- 顶部角的空隙对接口温度产生了最显著的影响.
- 纳米银糊降低了3%的模块温度,改善了5%的散热.
- 模块温度随着层厚度 (0.8°C/0.025mm) 的变化而线性增加.
结论:
- 接空隙特性对IGBT模块的热稳定性产生了重大影响.
- 空隙的战略位置和尺寸控制,以及使用纳米银等先进材料,可以提高热管理.
- 这些发现为设计更可靠,更热稳定的功率半导体设备提供了宝贵的见解.
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