P型GaN埋层对AlGaN/GaN HEMT温度的影响
Hanghang Lv1,2, Yanrong Cao1,2, Maodan Ma1,2
1School of Electronics & Mechanical Engineering, Xidian University, Xi'an 710071, China.
Micromachines
|July 29, 2023
概括
在高电子流动性晶体管 (HEMT) 中引入P型化 (GaN) 埋层,显著降低设备温度,并通过优化电场分布来提高故障性能.
科学领域:
- 半导体物理 半导体物理
- 材料科学 材料科学 材料科学
- 电子工程 电子工程
背景情况:
- 基于AlGaN/GaN的高电子移动性晶体管 (HEMT) 对高功率电子非常重要.
- 在HEMT中的自热效应可以降低性能和可靠性,导致负电阻.
- 在AlGaN/GaN HEMT中优化热管理对于先进的应用是必不可少的.
研究的目的:
- 研究P型GaN埋层对AlGaN/GaN HEMT的热特性的影响.
- 分析这种埋藏层对电场分布和自我加热效应的影响.
- 评估设备性能的提升,特别是故障特性.
主要方法:
- 使用Silvaco TCAD软件进行设备模拟.
- 在AlGaN/GaN HEMTs的缓冲层中引入了P型GaN层.
- 将热和电性能与传统设备结构进行比较.
主要成果:
- P型的GaN埋层显著降低了通道中的电场峰值.
- 观察到一个更均的电场分布.
- 设备晶格温度大幅降低,温度均性得到改善.
- 减轻因自热和增强分解性能而导致的负电阻.
结论:
- 整合P型GaN埋层是一种有效的战略,用于AlGaN/GaN HEMT的热管理.
- 这种方法通过减少自我加热来提高设备的可靠性和故障特性.
- 这些发现表明了开发更强大的高功率GaN设备的途径.
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