为双终端设备的内置包装
Ahmet Gulsaran1,2, Bersu Bastug Azer1,2, Dogu Ozyigit1,2
1Mechanical and Mechatronics Engineering Department, University of Waterloo, Waterloo, ON N2L 3G1, Canada.
Micromachines
|July 29, 2023
概括
这项研究引入了一种用于二极管的新型内置包装方法,显著提高了性能和可靠性. 这种创新方法为先进的电子应用提供了更简单,更具成本效益的解决方案.
科学领域:
- 电气工程 电气工程
- 材料科学 材料科学 材料科学
- 半导体设备物理 半导体设备物理
背景情况:
- 像二极管这样的双终端设备的传统包装通常使用昂贵的设备,导致寄生效应和可靠性问题.
- 现有的方法,如探测和电线粘合,在成本,尺寸和性能方面存在局限性.
- 电子元件需要更高效,更紧,更可靠的包装解决方案.
研究的目的:
- 为两端设备,特别是二极管提出和评估一种新的内置包装方法.
- 将内置包装方法的性能与传统的探测和电线粘合技术进行比较.
- 在电气特性和整体设备性能方面展示拟议方法的优势.
主要方法:
- 为两端设备开发了一种新的内置包装技术.
- 嵌入式包装的性能经过实验评估,并与探测和电线粘合相比较.
- 测量和分析了包括电流和电阻在内的关键电气参数.
主要成果:
- 嵌入式包装方法显示了更大的重叠面积和更好的抗接触性.
- 实验结果显示,包装式二极管的电流增加了12%,电阻降低了11%.
- 与传统方法相比,拟议的方法导致二极管性能提高.
结论:
- 嵌入式包装方法为传统技术提供了更简单,更便宜,更紧,更可靠的替代方案.
- 这种方法对改进诸如传感,无线电力传输,能源采集和太阳能电网等应用具有重大前景.
- 开发的包装解决方案为各种电子领域提供了更高效和先进的技术.
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