概括
我们开发了用于短波红外 (SWIR) 成像的高光谱共聚焦显微镜. 该技术允许在集成电路 (IC) 芯片上的功能电路组进行高分辨率检查和识别.
科学领域:
- 光学和光子学 在光学和光子学.
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
背景情况:
- 激光扫描共聚焦显微镜 (LSCM) 是一种强大的成像技术.
- 短波红外线 (SWIR) 为材料分析提供了独特的光学特性.
- 集成电路 (IC) 检查需要高分辨率,非侵入性方法.
研究的目的:
- 为了证明在SWIR范围 (1100-1600 nm) 的超光谱共聚焦显微镜.
- 为了实现IC芯片的高分辨率检查和功能分析.
- 探索在线检查和故障分析中的应用.
主要方法:
- 使用波长扫描激光与LSCM相结合.
- 在SWIR范围内获得的超光谱图像.
- 应用化学测量分析用于图像解释.
主要成果:
- 在SWIR范围内实现了IC芯片的高分辨率成像.
- 通过使用高光谱数据和化学分析成功识别了功能电路块组.
- 证明了非侵入性分析的潜力.
结论:
- 在SWIR范围内的高光谱共聚焦显微镜是用于IC检查的可行技术.
- 开发的仪器有助于识别功能电路组.
- 这项技术对IC的线内检查和故障分析具有前景.
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