概括
本研究介绍了一种用于光子集成电路的新型均格联器. 它实现了创纪录的96%的纤维到网格重叠,大大提高了量子应用的光合效率.
科学领域:
- 光子学 是一个光子学.
- 集成光学 集成光学 集成光学
- 量子技术 量子技术 量子技术
背景情况:
- 表面网格合器对于将光子集成电路 (PIC) 与光纤连接至关重要.
- 传统设计的方向性很低,纤维与格子之间的重叠很差,这限制了性能.
- 不统一的网格提高了效率,但使制造复杂化;统一的网格提供了更简单的制造,但理论上的重叠是有限的 (80%).
研究的目的:
- 提出一种新的统一格合器,克服了传统设计的重叠领域限制.
- 为了提高PIC与光纤接口的效率和性能.
- 为了实现混合量子光子集成电路的高效光合.
主要方法:
- 通过虚拟定向合器效应,利用层间模式干扰.
- 在化 (Si3N4) 平台上使用无形 (α-Si) 混合体.
- 优化层间间隙和格子几何,通过3D有限差异时间域 (FDTD) 模拟进行验证.
主要成果:
- 实现了前所未有的网格到纤维重叠96%的近高斯输出光束形状.
- 证明了高方向性 (84%) 和创纪录的低合损失-1.27dB.
- 在950 nm的均格合器中获得了20 nm的1 dB带宽.
结论:
- 拟议的统一格式合器显著提高了轻型合效率.
- 这种设计为高性能PIC光纤接口提供了实用解决方案,特别是用于量子应用.
- 该设备适用于使用III-V量子点单光子源的混合量子光子集成电路.
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