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三维集成使得光学中的超低噪声无隔离器激光器成为可能
Chao Xiang1,2, Warren Jin3,4, Osama Terra3,5
1Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, CA, USA. cxiang@eee.hku.hk.
Nature
|August 2, 2023
概括
三维集成使得光子集成电路上的超低噪声激光器成为可能. 这种进步克服了高精度应用的局限性,消除了光学隔离器的需求,为紧,坚固的光学系统铺平了道路.
科学领域:
- 光子学
- 材料科学
- 电气工程
背景情况:
- 光子集成电路 (PIC) 对电信和数据中心至关重要.
- 目前的PIC在微波合成器和原子钟等高精度应用中受限,原因是激光相位噪声和集成挑战.
- 集成超低噪声激光器和光学隔离器在芯片上对于推进这些应用至关重要.
研究的目的:
- 开发无光隔离器的光子超低噪声激光器.
- 证明高级PIC的三维 (3D) 集成的可行性.
- 克服半导体激光相位噪声和芯片内光学隔离器的局限性.
主要方法:
- 使用了结合单体和异质处理的三维整合技术.
- 集成的III-V增强介质与超低损失的化波导 (光学损失~0.5dB/m).
- 具有超高品质因子空洞的制造PIC,使其无隔离器操作.
主要成果:
- 在单个光子芯片上展示了超低噪声激光器和微波合成器.
- 由于超高质量的因子腔,实现了无隔离器的操作.
- 为复杂的功能展示了卓越的可扩展性,稳定性和可靠性.
结论:
- 在超低损耗的PIC上进行三维集成是迈向先进的光学系统的关键一步.
- 这种方法可以为苛刻的应用提供紧,坚固和高性能光子集成电路.
- 开发的PIC克服了未来光子技术的激光噪声和光学隔离方面的关键障碍.
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