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Updated: Jul 18, 2025

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基于芯片的系统与同轴TSV阵列的高效热应力合设计

Xianglong Wang1, Jiaming Su1, Dongdong Chen1

  • 1School of Microelectronics, Xidian University, Xi'an 710071, China.

Micromachines
|August 26, 2023
PubMed
概括

本研究介绍了使用同轴通过通过 (CTSV) 阵列的芯片系统的高效设计方法. 该方法优化了高性能互连结构的热应力合.

关键词:
基于芯片片的系统.同轴通过通过同轴通过.相互连接的结构结构.热应力合器的热应力合器

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