为IGBT电源模块集成微通道冷却板的热性能优化
Hanyang Xu1, Jiabo Huang1, Wenchao Tian1
1School of Electro-Mechanical Engineering, Xidian University, Xi'an 710071, China.
Micromachines
|August 26, 2023
概括
这项研究优化了碳化IGBT电源模块的微通道冷却板,显著降低了芯片温度. 然而,由于流体流动阻力,添加微型意外增加了温度.
科学领域:
- 功率电子中的热管理.
- 微流体和传热技术
背景情况:
- 绝缘门双极晶体管 (IGBT) 功率模块的高工作温度降低了集成电子元件的可靠性.
- 有效的热分析和冷却对于提高IGBT模块性能至关重要.
研究的目的:
- 为了研究用于碳化IGBT功率模块的集成微通道冷却板的散热.
- 分析BL系列微对冷却板效率的影响.
- 优化微通道冷却板设计,以提高热性能.
主要方法:
- 对IGBT电源模块的同等建模.
- 微通道冷却板与主通道和二次通道的热性能分析.
- 实验设计 (DOE) 采用直角模拟,变化微通道宽度,二次输入数和输入直径.
- 分析使用BL系列微和不使用BL系列微的冷却板性能.
主要成果:
- 微通道冷却板有效降低了IGBT芯片的温度.
- 增加微通道宽度,二次入口和入口直径会导致芯片结点温度降低.
- 最佳的设计参数 (宽度0.58毫米,入口13个,直径3.8毫米) 将芯片连接温度从677°C降低到77.7°C.
- 采用BL系列微型将芯片结点温度提高到110°C,原因是流量阻力增加.
结论:
- 优化的微通道冷却板设计显著提高了IGBT模块中的散热.
- 微可以通过增加流体流动阻力,对冷却效率产生负面影响.
- 这项研究为设计电力电子设备的先进冷却解决方案提供了基础.
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