纤维到芯片三维在绝缘器边缘合器具有高效率和耐受性
Xiaoyu Li1, Shengtao Yu2, Chengqun Gui1
1The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China.
Micromachines
|August 26, 2023
概括
为光学电路开发了高效的三维 (3D) 边缘合器. 这些新型合器在光纤到芯片集成方面表现出卓越的合效率和错位耐受性.
科学领域:
- 光子学 是一个光子学.
- 光学工程是指光学工程.
- 材料科学 材料科学 材料科学
背景情况:
- 边缘合器对于在光学电路中将外部光纤与芯片上的波导集成至关重要.
- 合效率直接影响光子设备的性能和集成能力.
- 现有的边缘合器设计往往面临效率和耐受性的局限性.
研究的目的:
- 提出和实验验证新的三维 (3D) 边缘合器.
- 为了实现高合效率和提高光纤到芯片连接的错位容忍度.
- 探索3D灰度光刻的潜力,用于制造先进的光学元件.
主要方法:
- 进行了理论计算,以验证拟议的3D边缘合器的高合效率.
- 三个不同的3D边缘合器设计是使用3D灰度刻画在厚平台上制造的.
- 在1550纳米波长频段进行实验测量,以评估TE和TM模式的合效率和失调容忍度.
主要成果:
- 对于TE/TM模式,分别实现了0.70 dB/-1.34 dB,0.80 dB/-1.60 dB和-1.00 dB/-1.14 dB的最大合效率.
- 调整误差容忍测量显示 ±5μm的水平容忍 (0.8dB/0.9dB为TE/TM) 和 ±2μm的垂直容忍 (1.7dB/1.0dB为TE/TM).
- 与传统设计相比,制造的3D边缘合器表现出明显的优势.
结论:
- 该研究成功地证明了通过3D灰度光刻法制造的高效率和高耐受性3D边缘合器.
- 这些结果为设计光通信和集成中的边缘合器提供了一个有希望的新方法.
- 开发的3D边缘合器显示了光子学研究和工业应用的巨大潜力.
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