热诱导包装对微电子机械系统共振加速器频率偏移的影响分析
Xiaorui Bie1, Xingyin Xiong1, Zheng Wang2
1Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China.
Micromachines
|August 26, 2023
概括
本研究介绍了微电机系统 (MEMS) 共振加速度计的新型包装设计,以最大限度地减少温度引起的频率漂移. 优化压力缓冲层显著提高了温度稳定性.
科学领域:
- 微电子机械系统 (MEMS) 工程
- 材料科学与工程 材料科学与工程
- 机械工程 机械工程
背景情况:
- 由于热效应,MEMS共振加速度计遭受不可避免的频率漂移,限制了它们的实际应用.
- 包装材料之间的热不匹配会诱导热力学应力,改变共振束的刚度并导致频率偏移.
- 减少热诱导的包装效应对于提高MEMS加速度计性能至关重要.
研究的目的:
- 为MEMS共振加速度计提出和研究一种新的包装设计,以减轻热诱导的频率漂移.
- 分析包装结构参数,特别是压力缓冲层对频率漂移的影响.
- 为提高MEMS共振加速度计的温度稳定性提供设计指南.
主要方法:
- 用有限元模拟来建模和分析MEMS共振加速度计内的热力学应力.
- 进行了实验验证,以验证模拟结果和拟议包装的有效性.
- 进行了参数研究,以调查压力缓冲层厚度和层厚度的影响.
主要成果:
- 拟议的无陶芯片载体包装带有应力缓冲层有效减少频率漂移.
- 增加压力缓冲层厚度和减少层厚度将共振束中的热力学应力降到最低.
- 优化包装结构,通过将中性平面与共振束的对称平面对齐,取消压力效应,并大大减少频率漂移.
结论:
- 开发的包装策略显著提高了MEMS共振加速度计的温度稳定性.
- 从这项研究中得出的设计准则使包装结构的优化能够最大限度地减少频率漂移.
- 这项研究有助于在不同温度的环境中更广泛地应用MEMS共振加速度计.
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