设计和模拟分析 3TnC MLC FeRAM 使用非破坏性读取和偏移取消感应放大器用于高密度存储应用程序的设计和模拟分析
Bo Peng1, Donglin Zhang2, Zhongqiang Wang1
1Key Laboratory of UV Light-Emitting Materials and Technology of Ministry of Education, Northeast Normal University, Changchun 130024, China.
Micromachines
|August 26, 2023
概括
基于氧化 (Hf0.5Zr0.5O2) 的多级细胞铁电随机存取存储器 (FeRAM) 提供高密度存储. 电路优化,包括非破坏性读出和偏移取消感应放大器,改善操作边际,降低偏移电压,以获得可靠的多级状态读取.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 计算机工程 计算机工程
背景情况:
- 基于氧化 (Hf0.5Zr0.5O2) 的多层细胞 (MLC) 铁电随机存取存储器 (FeRAM) 显示出对高密度存储的承诺.
- 现有的MLC FeRAM技术面临着小型操作边际和显著输入偏移电压的挑战.
研究的目的:
- 为了解决MLC FeRAM的局限性,本研究侧重于电路设计和优化.
- 为基于Hf0.5Zr0.5O2的3T1C MLC FeRAM.提议和模拟一个高效的电路配置.
主要方法:
- 一个SPICE模型被用来模拟Hf0.5Zr0.5O2内存设备中的八个可区分的极化状态.
- 采用非破坏性读取方法来增强相邻存储层之间的读取边缘.
- 一个无电容的偏移取消感应放大器 (SA) 旨在最大限度地降低偏移电压.
主要成果:
- 拟议的3T1C MLC FeRAM宏电路实现了每位12F2的高面积效率.
- 非破坏性读取方法使读取幅度扩大到450mV.
- 抵消偏移的SA成功将偏移电压降低到20mV,提高了读出可靠性.
- 一个4Mb的MLC FeRAM宏被模拟并使用130nm的CMOS工艺进行验证.
结论:
- 开发的电路设计为制造实用的Hf0.5Zr0.5O2基于MLC FeRAM芯片提供了基础.
- 这项工作突出了基于Hf0.5Zr0.5O2的MLC FeRAM在未来高密度存储应用中的潜力.
相关概念视频
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