在使用原子层蚀刻和高功率设备应用的门场板用于正常关闭的GaN入门MIS-HEMT中提高性能和故障电压
An-Chen Liu1, Po-Tsung Tu1,2, Hsin-Chu Chen3
1Department of Photonics, Institute of Electro-Optical Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Micromachines
|August 26, 2023
概括
这项研究介绍了原子层蚀刻 (ALE) 对于金属绝缘体半导体高电子流动性晶体管 (MIS-HEMT) 中的低损伤门插入. 该技术可实现高电流密度,故障电压和低电阻,用于先进的电子应用.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电气工程 电气工程
背景情况:
- 金属绝缘器半导体高电子流动性晶体管 (MIS-HEMT) 对于正常关闭的操作至关重要.
- 门退缩的MIS-HEMT提供高门电压扫描和低泄漏电流.
- 现有的门深化方法往往会造成损坏,限制性能.
研究的目的:
- 用原子层蚀刻 (ALE) 来演示MIS-HEMT的低损伤门蚀技术.
- 为了实现高电流密度和高断裂电压在入门MIS-HEMTs.
- 为了减少接口陷状态并改善阻力.
主要方法:
- 利用原子层蚀刻 (ALE) 进行低损坏的门加工.
- 制造的MIS-HEMT具有深陷门结构.
- 使用AFM和电气测量,描述设备性能,包括电流密度,故障电压和电阻.
主要成果:
- 实现了表面粗度 (Ra为0.40nm),与ALE之后的非蚀刻表面相比.
- 在VG = 6V和+2.0V的值电压下,证明了最大排水电流为608mA/mm.
- 获得了109的开/关电流比和1190V的故障电压.
- 由于界面陷状态减少,报告了6.8 Ω·mm的低电阻 (Ron).
结论:
- 在MIS-HEMT中,ALE技术有效地减少了门蚀刻过程中的损伤.
- 低损坏过程导致设备性能提高,包括更高的电流密度和故障电压.
- 这种方法为制造高性能,正常关闭的MIS-HEMT提供了可行的途径.
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