铜线结合:一个审查
Hongliang Zhou1, Andong Chang1, Junling Fan2
1School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.
Micromachines
|August 26, 2023
概括
本综述涵盖了铜 (Cu) 线粘合,细节线类型,自由空气球 (FAB) 形态影响,以及金属间化合物和腐蚀等可靠性因素. 它还探讨了模拟应用和线粘合技术的未来研究方向.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体制造业 半导体制造业
背景情况:
- 铜 (Cu) 线粘合是半导体包装中的关键互连技术.
- 了解Cu线的特性和粘合过程对于设备的可靠性至关重要.
研究的目的:
- 为提供铜 (Cu) 线粘合的全面审查.
- 分析影响Cu线缆结合可靠性的因素,并探索模拟应用.
主要方法:
- 关于Cu电线类型的文献综述,自由空气球 (FAB) 形态,金属间化合物和腐蚀.
- 模拟技术的分析,如有限元素分析和分子动力学.
主要成果:
- 详细讨论裸体,涂层,绝缘和合金Cu电线类型及其应用.
- 洞察FAB形态对键的强度和形成的影响.
- 评估金属间化合物和腐蚀对粘合可靠性的影响.
结论:
- 线粘合的可靠性受材料特性,工艺参数和环境因素的影响.
- 模拟工具对于理解粘合机制和预测故障至关重要.
- 未来的研究应该专注于推进线粘合技术和解决可靠性挑战.
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