用于声波发射应用的压电晶圆活性传感器传感器
Connor Griffin1, Victor Giurgiutiu1
1Department of Mechanical Engineering, University of South Carolina, Columbia, SC 29208, USA.
Sensors (Basel, Switzerland)
|August 26, 2023
概括
一种新的位捕获方法有效地验证了用于结构健康监测 (SHM) 的压电晶片活性传感器 (PWAS) 的质量. 这种方法可以检测传感器和粘合器的缺陷,并提供有关它们在SHM应用中的性能的见解.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 结构健康监测 结构健康监测
背景情况:
- 压电材料在机械应力下产生电荷,使传感应用成为可能.
- 结构健康监测 (SHM) 使用传感器检测基础设施的损坏.
- 压电晶圆活性传感器 (PWAS) 越来越多地用于SHM.
研究的目的:
- 调查一种用于评估PWAS仪器质量的新音位捕捉方法.
- 分析PWAS缺陷及其粘合对传感器响应的影响.
- 让我们比较一下pitch-catch方法与电机阻抗 (EMI) 方法的缺陷检测.
主要方法:
- 开发并应用了一种pitch-catch方法来评估PWAS.
- 引入了PWAS和粘合层中的缺陷,以模拟现实世界的条件.
- 记录和分析传输和接收信号,以及阻抗光谱.
主要成果:
- 基准捕捉方法成功验证了无缺陷的PWAS仪器仪表和粘合.
- 缺陷的PWAS和粘合导致信号振幅降低和频谱变化.
- 调度捕捉方法确定了粘合缺陷 (消除高频) 和破损PWAS (600 kHz振幅增加) 的特定信号变化.
- 通过EMI方法,在粘合缺陷和破损传感器的阻抗峰值中显示出明显的变化.
结论:
- 位捕获方法是评估SHM中PWAS质量的可行技术.
- 传感器和粘接缺陷显著改变PWAS信号特征.
- 无论是pitch-catch还是EMI方法都能检测到PWAS缺陷,但具有不同的可观察签名.
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