,Cu-Cu

Shih-Chi Yang1, Dinh-Phuc Tran1, Chih Chen1

  • 1Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.

PubMed
概括

在150°C的铜 (Cu) 接头中,电迁移导致了再结晶和谷物生长. 一些关节的意想不到的阻力下降与大粒生长有关,延长了它们的使用寿命.

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