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不同粘合剂对单立式和间接复合材料之间的剪接强度的影响

Elif Saracoglu Mergen, Zekeriya Yasar Comert, Dilara Seyma Alpkilic İşsever

The International journal of prosthodontics

|September 12, 2023

概括

在G-Premio Bond (GP) 和Tokuyama Universal Bond (TU) 之间,G-Premio Bond (GP) 和Tokuyama Universal Bond (TU) 在单质 (MZ) 和间接复合材料 (IC) 之间展示了优越的剪接强度 (SBS). 玻璃增强了SBS的特定剂,而热循环通常降低了键强度.

科学领域:

牙科材料科学牙科材料科学
生物材料工程生物材料工程
粘合式牙科粘合式牙科

背景情况:

单立体 (MZ) 和间接复合材料 (IC) 修复需要强大的界面粘附,以获得临床寿命.
优化粘合剂选择和表面处理对于可预测的临床结果至关重要.

研究的目的:

使用五种不同的粘合剂,评估单质 (MZ) 和间接复合材料 (IC) 之间的剪接强度 (SBS).
为了研究光应用和热循环对MZ-IC接口的粘合强度的影响.

主要方法:

200个MZ标本被分为玻璃化和非玻璃化组.
应用了五种粘合剂 (G-Premio Bond,Tokuyama Universal Bond,Signum Zirconia bond,Clearfil Ceramic Primer Plus,Z-Prime Plus) 这三种粘合剂,这些粘合剂可以在粘合剂中使用.
在使用通用测试机进行SBS测试之前,样品经过热循环或没有热循环.

主要成果:

对Z-Prime Plus和Clearfil Ceramic Primer Plus的光应用显著改善了SBS,但对于G-Premio Bond,Tokuyama Universal Bond或Signum Zirconia债券则没有.
在大多数组中,热循环显著降低了SBS,除了带光泽的G-Premio Bond外.
在测试条件下,G-Premio债券和东山环球债券表现出最高的SBS.

结论:

推使用G-Premio Bond和Tokuyama Universal Bond来实现单体石和间接复合材料之间的强大的结合.
表面处理 (玻璃) 和环境因素 (热循环) 显著影响MZ-IC修复的粘合耐久性.

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