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在超薄设备处理中的激光解锁应用.

Saiqiang Wang, Yang Yu, Song Li

    Applied optics
    |September 14, 2023
    PubMed
    概括
    此摘要是机器生成的。

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    研究人员探索了激光解接,以节省成本,生产超薄晶圆设备. 他们使用一种新的紫外线纳秒激光工艺成功实现了晶片的激光升起.

    科学领域:

    • 材料科学 材料科学 材料科学
    • 激光处理技术 激光处理技术
    • 半导体制造业 半导体制造业

    背景情况:

    • 激光解锁具有精度,速度和最小损坏等优势.
    • 在生产高性能超薄晶圆设备方面,需要具有成本效益的方法.

    研究的目的:

    • 为了研究激光处理的可行性,以低成本,高性能超薄晶圆设备制造.
    • 开发一种兼容的激光解工艺,用于临时粘合粘合剂.

    主要方法:

    • 使用了355nm紫外线纳秒激光器.
    • 开发了一种用于国内临时粘合剂的激光解工艺.
    • 采用直线光源成型系统,以优化激光点特征.

    主要成果:

    • 成功完成了8英寸/临时粘合/玻璃基板样品的激光提升.
    • 在功率密度为 250 mJ/cm2 的情况下实现起飞.
    • 开发了一种线性光源,产生一个点>1厘米,能量不均度<10%.

    结论:

    • 激光解接是一种可行的技术,用于生产超薄晶圆设备.
    • 开发的UV纳秒激光工艺对晶片的升起有效.

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  • 优化的线路光源提高了工艺效率和统一性.