用于微电子应用的环氧酸乙复合膜的固化动力学和机械性能
Shanjun Ding1, Zhidan Fang1, Zhongyao Yu1
1Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China.
ACS omega
|September 18, 2023
概括
使用差分扫描热量计分析了环氧/复合材料的固化动力学. 表面粘附性随着固化增加而减少,为微电子应用提供了洞察力.
科学领域:
- 材料科学 材料科学 材料科学
- 聚合物化学 聚合物化学
- 微电子工程 微电子工程
背景情况:
- 环氧树脂系统得到了广泛的研究,但微电子中的环氧酸复合物的详细固化动力学缺乏.
- 阿吉诺莫托的积聚膜,环氧/复合材料,在微电子行业中至关重要.
研究的目的:
- 研究用于微电子的环氧/复合材料的固化行为.
- 用既定模型和无模型方法分析固化动力学.
- 在不同的预固化条件下,评估积聚膜和铜之间的界面粘附.
主要方法:
- 非异热差扫描热量计 (DSC) 用于研究治愈行为.
- 分析使用了三种非异热固化动力学模型和无模型方法.
- 在沉积铜层在积聚膜上后,进行了界面粘附测试.
主要成果:
- 固化反应表现出两个不同的过程,分别适合自催化和卡马尔模型.
- 在整个固化过程中,使用无模型方法观察到可变的激活能量.
- 由于机械固,积聚膜和铜之间的界面粘附强度随着愈合度的增加而降低.
结论:
- 该研究提供了对环氧/复合材料固化动力学的全面了解.
- 这些发现为增强芯片基板的界面粘合和控制曲提供了指导.
- 这项研究有助于优化先进微电子包装的材料性能.
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