在铜超规格生长过程中对新水平基本蓝色1进行实验和理论研究
Yaqiang Li1,2, Chengzhi Li1, Ruopeng Li1
1MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China.
ACS applied materials & interfaces
|September 26, 2023
概括
一种新型的三甲衍生物,BB1,通过提高铜层质量,使微粒体中的超符合性电沉积成为可能. 最佳的BB1度 (100-200 mg/L) 提高了填充百分比和表面形态.
科学领域:
- 电化学 电化学 电化学
- 材料科学 材料科学 材料科学
- 表面化学 表面化学
背景情况:
- 超合规电极沉积对于先进的微电子互连至关重要.
- 控制微生物中的沉积均性和空隙形成仍然是一个挑战.
- 需要新的添加剂来增强铜电工艺.
研究的目的:
- 为了研究一种新的化功能组修饰的三甲衍生物BB1的有效性,作为微中超规格电沉积的平衡剂.
- 阐明铜电沉积过程中BB1的抑制和协同抑制机制.
- 优化BB1度以实现高质量的铜互连.
主要方法:
- 循环电压测量 (CV) 和电化学阻抗光谱 (EIS) 来研究BB1的抑制作用.
- 静电测量以分析依赖对流的吸附.
- 密度函数理论 (DFT) 计算和现场拉曼光谱用于机制研究.
- 扫描电子显微镜 (SEM),原子力显微镜 (AFM) 和X射线衍射 (XRD) 用于材料表征.
主要成果:
- 在100-200 mg/L的度范围内,BB1有效地促进了微的超合规填充.
- 确定了涉及BB1吸附和Cu2+协调的协同抑制机制.
- 增加的BB1度导致更光滑,更紧的铜层,增强 (220) 平面形成.
- 解决方案的湿透性得到了改善,并且在150 mg/L BB1.1下实现了高质量的铜互连.
结论:
- BB1是一种高效的水平器,可以在微粒中实现超符合性铜电沉积.
- 这项研究提供了对调节BB1性能的分子水平机制的见解.
- 优化的BB1添加结果是具有高填充百分比的优质铜互连.
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