一种埋藏的热轨 (BTR) 技术,以改善辅助场效应晶体管 (CFET) 的电热特性
Zhecheng Pan1, Tao Liu1, Jingwen Yang1
1School of Microelectronics, Fudan University, Shanghai 200433, China.
Micromachines
|September 28, 2023
概括
互补场效应晶体管 (CFET) 面临严重的自我加热. 埋藏热轨 (BTR) 技术显著降低了热阻,并提高了堆叠的N型FET (NFET) 和P型FET (PFET) 设备的性能.
科学领域:
- 半导体设备物理学 半导体设备物理
- 先进的晶体管架构的先进晶体管架构.
- 微电子中的热管理
背景情况:
- 互补场效晶体管 (CFET) 提供基于Gate-All-Around FET (GAAFET) 结构的高密度集成.
- CFET的堆叠性质加剧了自我加热效应 (SHE),影响了设备的性能和可靠性.
- 现有的解决方案,如埋电铁路 (BPR) 部分解决热问题.
研究的目的:
- 引入和评估埋藏热轨 (BTR) 技术,以提高CFET中的散热.
- 调查使用BTR和不同的电力输送方案的CFET的电热和寄生特征.
- 通过减轻自热效应来优化CFET性能.
主要方法:
- 系统的3D技术计算机辅助设计 (TCAD) 模拟被使用.
- 传统CFET,使用BPR的CFET和使用BTR的CFET之间的热电阻 (Rth) 和驱动能力的比较.
- 对不同功率输送结构的分析:顶部VDD-顶部VSS (TDTS),底部VDD-底部VSS (BDBS) 和底部VDD-顶部VSS (BDTS) 与BTR.
主要成果:
- 与传统结构和仅使用BPR的结构相比,BTR技术显著降低了CFET的热电阻 (Rth).
- 随着BTR的实施,驱动能力 (Ion) 显著改善.
- BTR-BDTS结构显示,NFET的Rth下降率为5%,PFET的Rth下降率为9%,NFET的Ion增加率为2%,PFET的Ion增加率为7%.
结论:
- 埋藏热轨 (BTR) 技术是一种有效的解决方案,可以减轻CFET的自我加热效应.
- BTR-BDTS配置为堆叠的FET设备提供了卓越的热管理和性能增强.
- 这一进步对于先进的半导体技术的持续扩展和可靠性至关重要.
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