原子薄的无形氧化半导体薄膜使用高性能氧化物晶体管的溶液工艺开发
Jun-Hyeong Park1, Won Park1, Jeong-Hyeon Na1
1School of Electronic and Electrical Engineering, Kyungpook National University, Daegu 41566, Republic of Korea.
Nanomaterials (Basel, Switzerland)
|September 28, 2023
概括
原子薄的氧化半导体是使用高性能薄膜晶体管 (TFT) 的溶液工艺开发的. 优化的3.12nm氧化TFT实现了新一代电子产品的高流动性和稳定性.
科学领域:
- 材料科学 材料科学 材料科学
- 电子工程 电子工程
- 纳米技术纳米技术
背景情况:
- 高性能氧化物晶体管对于显示器和传感器等现代电子设备至关重要.
- 原子薄的半导体是推动晶体管技术发展的关键.
研究的目的:
- 使用溶液工艺开发用于薄膜晶体管 (TFT) 的高性能,原子薄的氧化 (InO) 半导体.
- 通过控制溶液度以增强设备特性来调整InO的特性.
主要方法:
- 通过溶液工艺制造原子薄的InO半导体.
- 通过控制溶液度来调整 InO 带隙和厚度.
- 描述TFT性能,包括场效应移动性和开/关电流比.
主要成果:
- 实现了高场效移动性 (13.95 cm2 V−1 s−1) 和开/关电流比 (1.42 × 1010),厚度为 3.12 nm 的 InO.
- 证明了充电传输在优化 InO 薄膜中以透导电为主.
- 呈现出优越的门偏差应力稳定性,无论是积极的还是消极的偏差.
结论:
- 通过溶液处理,原子薄的INO TFTs为高性能电子设备提供了可行的途径.
- 优化的 InO 厚度和性能对于实现卓越的晶体管特性至关重要.
- 这些发现为可扩展,高通量制造先进晶体管铺平了道路.
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