对于基于GaN的设备而言,高热稳定的欧姆接触
Chia-Yi Wu1, Tien-Sheng Chao1, Yi-Chia Chou2
1Department of Electrophysics, National Yang Ming Chiao Tung University Hsinchu 300093 Taiwan.
Nanoscale advances
|September 28, 2023
概括
研究人员开发了一种新的,高度稳定的,使用化 (TiN) 为化 (GaN) 电源设备的无黄金欧姆接触器. 这项创新支持在高温下与集成电路 (IC) 进行协同集成.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电气工程 电气工程
背景情况:
- 与 (Si) 逻辑IC共同集成化 (GaN) 功率器件,可实现高功率,高效的单芯片解决方案.
- 一个关键的挑战是为耐高后端工艺温度的GaN设备开发Si兼容的欧姆接触.
研究的目的:
- 为AlGaN/GaN高电子流动性晶体管 (HEMT) 提供先进的,没有黄金的欧姆接触,具有卓越的热稳定性.
- 为了实现GaN电源设备与Si逻辑电路的可靠协同集成.
主要方法:
- 在AlGaN/GaN HEMTs上制造化 (TiN) 接触器.
- 在超过1000°C的温度下进行热稳定性测试.
- 使用扫描传输电子能量损失光谱 (STEM EELS) 进行接口化学分析.
主要成果:
- TiN接触器保持了欧姆特征,并在超过1000°C的温度下表现出异常稳定性.
- 根据STEM EELS的分析,Ga-N和Al-N的结合能增强,Ti扩散在1000°C以下可以忽略不计.
- 这些发现澄清了高度稳定的欧姆接触形成背后的机制.
结论:
- 一种使用TiN的新的,热强的,无黄金的欧姆接触已经成功地为AlGaN/GaN HEMTs开发出来.
- 这一突破为可靠的GaN设备接触提供了可行的途径,对于先进的Si/GaN联合集成至关重要.
- 该研究为HEMT和其他基于GaN的设备形成稳定的欧姆接触提供了新的见解.
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