一个绿色合规的热成型印刷电路板来源于可再生材料
Amirsoheil Honarbari1,2, Pietro Cataldi1, Arkadiusz Zych1
1Smart Materials, Istituto Italiano di Tecnologia, Via Morego 30, Genova 16163, Italy.
ACS applied electronic materials
|October 2, 2023
概括
研究人员开发了一种可堆肥印刷电路板 (PCB) 基板,使用聚乳酸和棉织物作为传统FR4的可持续替代品. 这种环保材料支持印刷电子产品,并减少电子垃圾.
科学领域:
- 材料科学 材料科学 材料科学
- 可持续工程 可持续工程
- 聚合物科学 聚合物科学
背景情况:
- 印刷电路板 (PCB) 对于电子设备至关重要,FR4是标准基板.
- 玻璃纤维增强环氧树脂FR4缺乏可持续性,并导致电子垃圾.
- 对于可生物降解或可堆肥的环保PCB基材有着至关重要的需求.
研究的目的:
- 开发和描述一种新的可堆肥PCB基板,作为FR4的可持续替代品.
- 评估基板适合用于导电性油墨的增材印刷和组件集成.
- 为了证明这种绿色基板在减少电子垃圾对环境的影响方面的潜力.
主要方法:
- 通过压缩成型使用聚合乳酸和棉织物开发了PCB基板.
- 具有特征的基质形态,湿度 (水接触角度) 和介电性质.
- 评估热成型能力和适用于微型钻井的适用性.
- 打印了导电银墨水,并用LED组装了一个功能电路.
主要成果:
- 聚 (乳酸) -棉布基板的介电性质与FR4.4相似.
- 它的表面形态和湿透性 (水接触角度为72°) 适合添加剂银墨印刷.
- 基板可以在不影响导电性的情况下热成型成曲形状.
- 一个原理证明电路证明了基板的功能,用于电子元件集成.
结论:
- 开发的可堆肥PCB基板为传统FR4提供了一个可行的,可持续的替代方案.
- 这一创新可以大大帮助减少电子垃圾对环境的负担.
- 该材料的特性支持关键PCB制造工艺和功能电路实现.
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