堆叠序列对/层材料内的机械性能和微观结构特征的影响
Lenka Kunčická1,2, Radim Kocich1
1Faculty of Materials Science and Technology, VŠB-Technical University of Ostrava, 17. Listopadu 2172/15, 70800 Ostrava, Czech Republic.
Materials (Basel, Switzerland)
|October 14, 2023
概括
这项研究详细介绍了Al/Cu导体的旋转交换,揭示了铜中的细微结构和残余应力. 不同的堆叠序列显示出相似的强度,但可塑性各异,Al/Cu线设计具有较低的可塑性.
科学领域:
- 材料科学 材料科学 材料科学
- 金工业是金工业的一个方面.
- 机械工程 机械工程
背景情况:
- 先进的金属导体对于各种工业应用至关重要.
- 了解加工对材料性能的影响对于性能优化至关重要.
- 铜 (Al/Cu) 层面板具有增强电气和机械性能的潜力.
研究的目的:
- 为了研究使用旋转互换制备Al/Cu层状导体的制备.
- 描述微观结构的演变,接口完整性和残余应力.
- 评估不同层状结构的机械性能,特别是拉伸强度和可塑性.
主要方法:
- 在室温下旋转交换以创建Al/Cu层状导体.
- 使用电子显微镜和纹理分析进行微结构分析.
- 评估内部误导,以确定剩余的压力.
- 拉力测试和微硬度测量以确定机械性能.
主要成果:
- 旋转交换产生了精细的,在Al和Cu组件中具有最小纹理的等轴粒.
- 剩余应力主要在铜组件中观察到,这表明中的动态再结晶.
- 这两种层设计都实现了接近280MPa的高最终抗拉强度 (UTS).
- 发现了可塑性的显著差异,其中一个配置显示~3.5%和另一个<1%,归因于的加工硬化.
结论:
- 旋转交换是一种有效的方法,用于生产具有令人满意的界面粘接的Al/Cu层状导体.
- 微结构分析揭示了动态的恢复过程和局部的残余应力.
- 层材设计显著影响塑性,对需要可塑性的导体应用有影响.
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