对聚合物介电剂的审查,用于插座器和包装基质中的再分配层

Pratik Nimbalkar1, Pragna Bhaskar1, Mohanalingam Kathaperumal1

  • 13D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332, USA.

Polymers
|October 14, 2023
PubMed
概括

下一代计算依赖于先进的插入器和包基板. 本综述考察了聚合物介电材料,强调了在异质集成中高带宽连接的制造和可靠性挑战.