调查扩散对SiC/Al复合界面的凝聚区模型的影响
Masoud Tahani1,2, Eligiusz Postek2, Tomasz Sadowski3
1Department of Mechanical Engineering, Ferdowsi University of Mashhad, Mashhad 9177948974, Iran.
Molecules (Basel, Switzerland)
|October 14, 2023
概括
对SiC/Al复合材料的热处理产生了一个扩散区,增强了接口强度和分离工作. 分子动力学模拟显示,这种扩散层可以改善机械性能,而不会显著改变弹性模块.
科学领域:
- 材料科学 材料科学 材料科学
- 计算材料科学科学 计算材料科学
- 机械工程 机械工程
背景情况:
- 建模金属矩阵复合材料需要连接区模型 (CZM) 进行界面行为.
- 热处理和扩散区的形成使界面属性的实验性确定变得复杂.
- 了解扩散对引分离 (T-S) 规律的影响至关重要.
研究的目的:
- 研究扩散区形成对SiC/Al复合材料T-S定律的影响.
- 在各种负载条件下分析热处理对接口机械性能的影响.
- 将接口强度与散装材料的性能进行比较.
主要方法:
- 采用了分子动力学模拟.
- 模拟拉伸,剪切和混合模式负载.
- 分析了带有和没有扩散区的SiC/Al接口的引分离行为.
主要成果:
- 扩散层的形成增加了拉力和剪切强度和分离工作.
- 弹性和剪切模块在很大程度上不受扩散层的影响.
- 扩散区域的剪切强度超过了滑平面的剪切强度,防止在纯剪切下裂传播.
结论:
- 热处理和随后的扩散区形成提高了SiC/Al复合材料的界面机械强度.
- 扩散区作为比散装更强的接口,促进剪切滑动在裂传播.
- 分子动力学对于研究由复合材料的热处理影响的接口行为是有效的.
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