在印刷电路板技术中制造的细分2D读取板用于气体电子倍数探测器
Michał Babij1,2, Piotr Bielówka1,2, Szymon Gburek3
1Department of Microsystems, Faculty of Electronics, Photonics and Microsystems, Wrocław University of Science and Technology, wyb. S. Wyspiańskiego 27, 50-370 Wrocław, Poland.
Sensors (Basel, Switzerland)
|October 14, 2023
概括
本研究介绍了一种新的,具有成本效益的方法,用于制造使用标准印刷电路板 (PCB) 技术的气体电子倍增器 (GEM) 探测器读取板. 这一创新简化了生产,并提高了高能物理 (HEP) 实验的灵活性.
科学领域:
- 高能物理 (HEP) 高能物理
- 粒子探测器技术 粒子探测器技术
- 先进制造先进制造 制造先进制造
背景情况:
- 气电子乘数 (GEM) 探测器在高能物理 (HEP) 实验中至关重要.
- 目前的GEM读取板使用专业的,专利的蚀刻工艺,限制了制造的可访问性和增加成本.
- 现有的读取板生产集中在少数研究中心.
研究的目的:
- 提出和验证一种用于制造GEM探测器读取板的新方法.
- 为了简化生产过程并降低GEM探测器的整体成本.
- 为当前最先进的读取板技术提供更容易获得和灵活的替代方案.
主要方法:
- 开发使用标准印刷电路板 (PCB) 技术的读取板设计.
- 板块化PCB段,以创建更大的活跃区域,最小的间隙.
- 通过X射线放射和性能测量验证拟议的技术.
主要成果:
- 提出的基于PCB的读取板是使用标准工业工艺制造的.
- X射线放射图证实了该技术适用于GEM探测器应用的适用性.
- 新方法避免了专利的微化学路径 (MCV) 蚀刻,允许任何PCB制造商生产.
结论:
- 开发的PCB技术为生产GEM探测器读取板提供了一种简化,更低成本,更容易使用的方法.
- 这种方法为未来的HEP实验提供了更大的设计灵活性和可扩展性.
- 验证的技术克服了当前专有制造方法的局限性.
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