在InGaN/GaN接口上的 (a+c) 不合适位移的分离
J Smalc-Koziorowska1, J Moneta1, G Muzioł1
1Institute of High Pressure Physics, Polish Academy of Sciences, Warsaw, Poland.
Journal of microscopy
|October 17, 2023
概括
在InGaN/GaN层中的错位位移解离成部分位移,这对于理解半导体生长至关重要. 这种由压力驱动的解离会影响先进电子设备中松散的InGaN缓冲层的形成.
科学领域:
- 材料科学 材料科学 材料科学
- 固态物理 固态物理
- 半导体异构结构 半导体异构结构
背景情况:
- 六角形材料通常表现为 (a+c) 位移,分离成部分位移.
- 宽松的InGaN缓冲层对于沉积高含量结构至关重要.
- 了解InGaN/GaN接口上的不合适 (a+c) 失位解离是控制核化和滑翔的关键.
研究的目的:
- 研究GaN基板上的塑性放松的InGaN层中不合适 (a+c) 位移的解离机制.
- 描述这些分离失位的结构和行为.
- 阐明压力在解离过程中的作用.
主要方法:
- 高分辨率显微镜观察脱位网络和解离.
- 原子模拟来建模离散边缘 (a+c) 位移的核心结构.
- 在InGaN/GaN接口上的失调网络的分析.
主要成果:
- 在InGaN/GaN接口观察到一个 (a+c) 位移的三角网络,从<100>方向旋转3°.
- 发现异位分裂成两个弗兰克-肖克利1/6<203>部分异位,并具有I1堆叠故障.
- 原子模拟揭示了部分位移核心的3/5原子环结构.
- 部分失位的分离表明登,可能是由不匹配的压力引起的.
结论:
- 在InGaN/GaN中不合适 (a+c) 位移的解离涉及弗兰克-肖克利部分和I1堆叠故障.
- 脱位爬,可能是压力引起的,在观察到的部分脱位分离中起作用.
- 这项研究为控制化物半导体脱位行为的机制提供了关键的见解,影响了设备性能.
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