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DTCO优化了关键路径网络,以提高芯片性能,并通过深紫外线光刻法深紫外线光刻技术的定时感知OPC进行了优化
Applied optics
|October 19, 2023
概括
设计技术协同优化 (DTCO) 降低了芯片设计的复杂性和成本. 一种新的定时感知优化光学近距离校正 (OPC) 方法最大限度地减少了工艺变化和边缘放置错误,以提高芯片性能.
科学领域:
- 半导体制造业 半导体制造业
- 集成电路设计 集成电路设计
- 石版技术 石版技术 石版技术
背景情况:
- 在半导体制造业中,度缩放面临着越来越高的成本和复杂性.
- 石版印刷是集成电路中尺寸缩放的一个关键驱动器.
- 工艺变化 (PV) 和边缘位置错误 (EPE) 影响芯片性能和产量.
研究的目的:
- 提出设计技术协同优化 (DTCO) 流程,以减轻光伏频段和EPE.
- 为了减少高性能处理器中过程变化和边缘放置错误的影响.
- 通过优化关键设计路径来提高芯片性能.
主要方法:
- 高性能处理器的数字后端设计和测试布局的生成.
- 时间分析以确定影响芯片性能的关键路径网络.
- 开发一个时刻意识的优化光学近距离校正 (OPC) 方法.
主要成果:
- 拟议的时间意识的OPC方法调整了关键路径净优点和次级分辨率助理功能.
- 对关键路径应用了更严格的EPE规范和更密集的优点/断点.
- 实现了EPE的显著减少和光伏频段的轻微减少.
结论:
- 拟议的DTCO流量有效地减少了EPE和PV频段,同时保持了过程窗口.
- 这种方法为管理先进半导体制造中的复杂性和成本提供了可行的策略.
- 基于时间关键性的优化OPC提高了整体芯片性能和制造能力.
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