通过接口工程诱导的Hf0.5Zr0.5O2铁电膜的增强开关可靠性
Fei Huang1, Balreen Saini2, Zhouchangwan Yu1
1Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States.
ACS applied materials & interfaces
|October 19, 2023
概括
在氧化 (HZO) 铁电电容器中引入超薄的氧化缓冲层几乎可以消除极化"唤醒"效应. 这一进步提高了HZO薄膜的稳定性,用于先进的半导体内存应用.
科学领域:
- 材料科学 材料科学 材料科学
- 固态物理 固态物理
- 纳米技术纳米技术
背景情况:
- 基于的铁电薄膜,如氧化 (HZO),由于CMOS兼容性,对缩放的半导体内存充满希望.
- 极化不稳定性,特别是"唤醒"效应,阻碍了这些材料的技术实施.
- 了解在场循环过程中偏振变化背后的机制对于设备改进至关重要.
研究的目的:
- 研究用于减轻铁电Hf0.5Zr0.5O2 (HZO) 电容器中的偏振唤醒效应的方法.
- 阐明HZO/电极接口在HZO铁电性能和唤醒机制中的作用.
主要方法:
- 在HZO/电极接口上具有或没有超薄HfO2缓冲层的HZO电容器的制造.
- 高分辨率传输电子显微镜 (HRTEM) 用于分析薄膜微观结构和晶体尺寸.
- 同步射线X射线衍射 (XRD) 在电场循环过程中研究相变 (四边形到正边形).
主要成果:
- 带有HfO2缓冲层的HZO电容器表现出显著减少的极化唤醒.
- HRTEM在缓冲层电容器中发现了更大的晶体体尺寸,表明化过程中受影响的结晶.
- 在控制器件中,XRD证实了非极性四边形 (T) 阶段转换为极性正方形 (O) 阶段,与唤醒相关,而缓冲层最初促进了O阶段.
结论:
- 超薄的HfO2缓冲层有效地抑制了HZO铁电容器中的极化唤醒现象.
- 缓冲层影响HZO结晶,促进所需极相的形成并增强设备的稳定性.
- 这些发现为优化基于哈夫尼亚的铁电在先进的记忆技术中的接口工程提供了关键的见解.
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