侧门铁电场效应晶体管 (LG-FeFET) 使用α-In2Se3用于堆叠的内存计算阵列
Sangyong Park1,2, Dongyoung Lee3, Juncheol Kang3
1Flash Technology Development Team, R&D Center, Device Solutions, Samsung Electronics Co. Ltd, Hwasung, 18448, Korea.
Nature communications
|October 25, 2023
概括
我们开发了一种高密度堆叠的铁电记忆阵列,使用侧门铁电场效应晶体管 (LG-FeFET) 进行高效的内存计算. 这种新型设备可以实现更快的数据处理,具有出色的性能和耐久性.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 计算机科学 计算机科学
背景情况:
- 内存计算通过避免数据传输提供了高效的数据处理.
- 高密度内存阵列对于在此类系统中管理大量数据量至关重要.
- 现有的解决方案在实现所需的密度和集成方面面临挑战.
研究的目的:
- 介绍一款用于内存计算的新型堆叠铁电式内存阵列.
- 在高密度内存应用中展示横门铁电场效应晶体管 (LG-FeFET) 的潜力.
- 为了验证3D堆叠结构的可行性,以实现高效的计算任务.
主要方法:
- 使用侧门铁电场效应晶体管 (LG-FeFETs) 制造堆叠的铁电记忆阵列.
- 利用α-In2Se3的相互锁定效应来控制通道导电.
- 描述LG-FeFET的特性,包括内存窗口,切换,保留和耐久性.
- 设计和实施一个3D堆叠的内存结构.
- 通过多次积累 (MAC) 操作验证结构的性能.
主要成果:
- LG-FeFET 具有广泛的内存窗口,有效的铁电切换和长时间的保留时间 (>3×10^4 秒).
- 这些设备具有很高的耐用性 (>10^5周期).
- 由于降低了设备高度,可以实现垂直堆叠的结构,简化了集成.
- 一个双层堆叠的内存配置成功执行了多重积累 (MAC) 操作.
结论:
- 开发的基于LG-FeFET的堆叠内存阵列是高密度内存计算的有希望的候选者.
- 该设备的特性和适合3D集成的特性解决了数据密集型计算中的关键挑战.
- 这项技术为更高效,更强大的计算系统铺平了道路.
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