对于由反场效应晶体管组成的单立体三维非挥发性内存的电气合效应的研究,使用TCAD
1ICT & Robotics Engineering, Semiconductor Convergence Engineering, AISPC Laboratory and IITC, Hankyong National University, 327 Jungang-ro, Anseong-si 17579, Gyenggi-do, Republic of Korea.
Micromachines
|October 28, 2023
概括
这项研究研究了使用反场效应晶体管 (M3D-NVM-FBFETs) 的单立体3D非挥发性内存. 更薄的间层介电介电材料增强了电气合,但需要仔细设计才能实现可靠的内存操作.
科学领域:
- 半导体设备物理学 半导体设备物理
- 材料科学是一种材料科学.
背景情况:
- 单立体3D非挥发性内存 (M3D-NVM) 提供了先进的集成.
- 反场效应晶体管 (FBFET) 是M3D-NVM-FBFET的关键组件.
研究的目的:
- 研究M3D-NVM-FBFETs的电气特性.
- 在M3D-NVM-FBFET中分析电气合效应.
- 评估介层介电厚对设备性能的影响.
主要方法:
- 技术计算机辅助设计 (TCAD) 模拟.
- 编程/删除电压和内存窗口的分析.
- 对于10年数据存储的保留模拟.
主要成果:
- M3D-NVM-FBFET的内存窗口为1.98V,在10年后降至0.83V.
- 观察并量化了电气合效应.
- 降低层间介电厚度 (T) 从100到10纳米显著增加了电压转移 (0.16-0.87V用于编程,0.15-0.84V用于删除).
结论:
- M3D-NVM-FBFET显示出有希望的内存特性.
- 电气合是一个关键因素,特别是在薄间层介电介质 (<= 50 nm) 时.
- 需要仔细设计,以减轻先进的M3D-NVM-FBFET电路中的合效应.
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