总电离剂量对GaN电源码设备的值电压的影响
Hao Wu1, Xiaojun Fu1, Jun Luo2
1National Key Laboratory of Integrated Circuits and Microsystems, Chongqing 401332, China.
Micromachines
|October 28, 2023
概括
这项研究研究了对化 (GaN) Cascode 设备的总电离剂量 (TID) 影响. 经过辐射加固的MOSFET提高了TID耐受性,火有助于恢复值电压,显示了GaN.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体设备物理 半导体设备物理
- 电子产品中的辐射效应.
背景情况:
- 化 (GaN) 设备在高压,高频和辐射硬化应用中越来越突出.
- 码设备将低压MOSFET与高压GaN金属绝缘高电子移动性晶体管 (MISHEMT) 集成.
- 了解总电离剂量 (TID) 对这些复杂结构的影响对于在恶劣环境中可靠运行至关重要.
研究的目的:
- 为了评估对 E 模式 GaN Cascode 设备的总电离剂量 (TID) 影响.
- 为了研究化对GaN Cascode设备辐射后性能的影响.
- 为了比较GaN Cascode设备与传统和辐射硬化MOSFET的辐射耐受性.
主要方法:
- 制造使用传统和辐射硬化MOSFET的GaN Cascode设备.
- 制造设备暴露于不同水平的总电离剂量 (TID).
- 辐射后回火实验,以评估电荷回收和值电压 (VTH) 转移.
主要成果:
- 传统的基于MOSFET的Cascode设备在100krad时表现出负的VTH转移.
- 基于辐射硬化MOSFET的Cascode设备在100krad (Si) 时显示出0.5V VTH转移,在500krad (Si) 时显示出显著的转移.
- 化有效地释放了被困电荷,促进了VTH在被辐射的Cascode设备中的恢复.
结论:
- MOSFET组件是Cascode设备反TID能力的主要决定因素,类似的VTH转移和恢复趋势证明了这一点.
- 与 (Si) 相比,GaN材料的抗TID性能优于 (Si),这是由GaN Cascode设备中的VTH转移较小而不是报告的p-GaN HEMT显示的.
- 辐射加固的MOSFET显著提高了GaN Cascode设备的TID耐受性,使它们更适合要求高的电子应用.
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