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使用各种极性溶剂和酸性激活剂的铜烧结糊

Seungyeon Lee¹, Seong-Ju Han¹, Yongjune Kim²

¹Department of Polymer Engineering, School of Chemical and Materials Engineering, The University of Suwon, Hwaseong, Gyeonggi-do 18323, Republic of Korea.

|October 30, 2023

概括

这项研究优化了用于半导体包装的铜烧结糊. 以乙醇为基础的面料与酸添加剂产生了最高的电导率和机械强度,提高了设备的可靠性.

科学领域:

材料科学材料科学材料科学
纳米技术纳米技术
半导体制造业半导体制造业

背景情况:

先进的半导体设备需要高密度的包装解决方案,超出传统的电线粘合和接.
烧结为微电子应用提供了一种稳定的粘合方法,克服了传统技术的局限性.
优化铜 (Cu) 烧结糊的组成对于提高微电子包装性能至关重要.

研究的目的:

研究各种添加剂和溶剂对Cu烧结材料性能的影响.
为了确定Cu烧结糊的最佳组成和粘合条件.
为了评估半导体应用中烧结Cu材料的机械和电气特性.

主要方法:

使用1μm的Cu颗粒与各种溶剂 (甲醇,乙醇,乙烯基醇) 和酸性添加剂 (酸,酸,六酸) 制造Cu烧结材料.
优化溶剂与酸的比率,以提高粘度和长期储存.
在烧结过程后评估机械强度和电导率.

主要成果:

作为溶剂的乙醇 (EtOH) 始终在所有配方中产生了最高的烧结性能.
添加剂中的芳香和碳酸组显著提高了烧结性能和电导率.
最优的组成,EtOH/PA (叶酸),证明了优越的电导率 (约. 10^4 S/m) 和机械强度 (34.0 MPa),其O/Cu比为2.23%.

结论:

溶剂和添加剂的选择对于实现高性能Cu烧结糊来说至关重要.
乙醇和酸为烧结Cu互连中增强的电气和机械性能提供了最佳条件.
这项研究为定制烧结工艺提供了有价值的见解,以保持先进的半导体包装中的电完整性.

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