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低通透度和低温度烧焦的BaSO₄-BaF₂微波介电陶用于高可靠性的封装电子产品

Wei Wang¹, Muhammad Shehbaz¹, Xin Wang¹

¹Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, School of Electronic Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, Shaanxi China.

ACS applied materials & interfaces

|October 30, 2023

概括

本研究引入了一种新型高CTE BaSO4-BaF2 LTCC材料,以解决先进电子包装中的热膨胀不匹配问题. 这种陶为高密度包装应用提供了出色的性能和可靠性.

科学领域:

材料科学材料科学材料科学
陶工程陶工程
电子包装电子包装

背景情况:

热膨胀系数 (CTE) 不匹配是LTCC在可靠电子包装方面面临的关键挑战.
有机层状材料和接材料的CTE比传统的低允许度陶高,导致可靠性问题.

研究的目的:

提出高CTE BaSO4-BaF2 LTCC材料作为高可靠性封装电子产品的解决方案.
为了解决LTCC材料和其他电子元件之间的CTE不匹配问题.

主要方法:

对BaSO4-BaF2 LTCC陶的开发和表征.
在低温 (650-850°C) 中烧结.
使用开发的LTCC材料制造和测试一个介电共振天线.

主要成果:

这种95%重量%BaSO4-5重量%BaF2陶的CTE值为+21.8 ppm/°C,介电损耗低 (Q × f = 40,100 GHz),热导率好 (1.3 W/mK).
一个介电共振天线实现了6.0dBi的增益和90%的辐射效率.
有限元分析证实了有机层层和合剂的良好CTE匹配和低热应力.

结论:

BaSO4-BaF2 LTCC是高可靠性包装电子产品的有希望的材料,因为它具有可调节的CTE和优良的介电性质.
该材料的广泛烧结范围和Ag兼容性进一步提高了其适用于LTCC技术的适用性.
这种LTCC解决方案有效地减轻了先进电子包装中的热应力.

关键词:

作为一个LTCC,它是LTCC.的热膨胀系数.有限元分析是有限元分析.微波的介电特性微波的介电性质可靠性的可靠性

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