Cu3 BiS3:二维协调诱导出平面外的声子散射,使得超低导热率成为可能
Fei Jia1, Shuang Zhao1,2, Jing Wu3
1Center for Advanced Materials Research, Beijing Normal University, Zhuhai, Zhuhai, 519087, P. R. China.
Angewandte Chemie (International ed. in English)
|November 7, 2023
概括
我们发现了Cu3BiS3,一个独特的三元硫化物,由于2D [CuS3]协调,具有超低的导热率. 这种结构增强了声子散射,与CuBiS2.2相比,显著降低了导热率.
科学领域:
- 材料科学 材料科学 材料科学
- 固态物理 固态物理
- 无机化学 无机化学
背景情况:
- 发现具有低导热性的材料对于热管理应用至关重要.
- 了解固体中热传输的微观起源仍然是一个重大的科学挑战.
研究的目的:
- 报告一种新型的三元硫化物化合物,Cu3BiS3,具有非常低的导热率.
- 阐明了局部原子协调和声子散射机制之间的关系,这些机制负责降低导热率.
主要方法:
- 密度函数理论 (DFT) 的计算被用来分析音声频谱.
- 计算了格子的导热率 (κlat),并将Cu3BiS3和CuBiS2.2进行比较.
- 分析了原子协调环境和键长度.
主要成果:
- 在Cu3BiS3中,所有铜原子都具有独特的2D[CuS3]三角协调,与CuBiS2.2.中的四面体[CuS4]不同.
- 这种二维协调促进了有效的外平面声子散射,将最小振动频率降低到1.5 THz.
- Cu3BiS3实现了0.32 W/m·K的超低晶格导热率,比CuBiS2 (0.50 W/m·K) 降低了36%.
- 在Cu3BiS3.3中观察到一个大的格鲁尼森参数 (2.06).
结论:
- 在Cu3BiS3中的2D [CuS3]三角协调是实现超低导热的关键因素.
- 由特定的Cu协调驱动的平面外的声子散射,显著减少了热传输.
- 这项研究突出了控制局部原子结构的潜力,以设计材料的热特性.
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