含有甲基的无形聚合物 (乙烯基) 具有出色的耐热性,介电性和机械性能
Jingwei Jiang1,2, Zhichao Wang2, Yunlong Sun1
1Division of Energy Materials (DNL22), Dalian Institute of Chemical Physics of the Chinese Academy of Sciences, Dalian 116023, China.
新型聚乙烯基 (PAEK) 聚合物为5G技术进行了合成. 这些材料具有较低的介电常数,优良的机械性能和耐热性,使它们非常适合高频应用.
科学领域:
- 材料科学 材料科学 材料科学
- 聚合物化学 聚合物化学
- 微电子工程 微电子工程
背景情况:
- 低介电常量聚合物对于微电子非常重要.
- 5G技术要求在高频率下具有低介电常数,良好的耐热性和机械强度的材料.
研究的目的:
- 合成新型聚乙烯基 (PAEK) 材料.
- 评估它们的介电,机械和热性能,用于高频通信应用.
主要方法:
- 通过核友多重凝结合成四种新型PAEKs.
- 在10 GHz时介电性质的表征.
- 构建一个无形积累电池模型,以将介电常数与甲基相关联.
- 评估机械性能 (模量,拉力强度,破裂时的延长).
- 确定玻璃过渡温度 (Tg).
主要成果:
- 合成的PAEK薄膜在10 GHz时表现出低压电常数,低至2.76.
- 无形积累细胞模型证明了介电常数和甲基基含量之间的关系.
- 观察到有利的机械性能:扬模量 (2.17-2.21 GPa),拉伸强度 (82.0-88.5 MPa) 和破裂时的延伸 (7.94%).
- 在玻璃过渡温度 (Tg) 为216°C时,证实了良好的耐热性.
结论:
- 新型PAEK具有出色的介电,机械和热性能.
- 这些材料是高频通信应用的有希望的候选者.
- 加入甲基组有效调整介电和机械性能.
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