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High Throughput Single-cell and Multiple-cell Micro-encapsulation
Published on: June 15, 2012
Yanhong Guo1,2,3,4, Tuo Hou2,3,4, Jing Wang4,5
1Institute for Advanced Study, Shenzhen University, Shenzhen, 518060, China.
基于微流体的微封装相变材料 (MEPCM) 通过克服传统相变材料 (PCM) 的局限性,提供了改进的热能存储. 本综述详细介绍了它们的制备,特性和各种应用.
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