在高性能2Dp-FET中,通过范德瓦尔斯集成和接触间隔剂兴奋剂,实现自行对齐的顶端门结构
Tien Dat Ngo1, Tuyen Huynh1, Inyong Moon2
1SKKU Advanced Institute of Nano Technology, Sungkyunkwan University, Suwon, Gyeonggi-do 16419, Republic of Korea.
Nano letters
|November 20, 2023
概括
研究人员开发了新的2D材料p型场效应晶体管 (p-FETs),使用自我调整的顶端门堆和选择性等离子体兴奋剂. 这一突破使得高性能的p-FET和低功耗的互补金属氧化物半导体 (CMOS) 设备成为可能.
科学领域:
- 半导体物理 半导体物理
- 材料科学 材料科学 材料科学
- 纳米技术纳米技术
背景情况:
- 互补金属氧化物半导体 (CMOS) 技术的进步依赖于高性能p型场效应晶体管 (p-FETs),这些晶体管目前是二维 (2D) 材料的瓶.
- 现有的顶端门 (TG) 结构与p-doped间隔器面临着理想的p-FET和PMOS逆变器的重大制造挑战.
研究的目的:
- 介绍一种新的制造方法,用于侧面的p+-p-p+连接 WSe2 FETs 与自行调整的TG堆.
- 克服使用二维材料实现理想的p-FET和PMOS逆变器的局限性.
主要方法:
- 使用范德瓦尔斯 (vdW) 集成制造侧面的p+-p-p+连接 WSe2 FET.
- 选择性氧气等离子体对间隔区域进行注,以形成所需的结点.
- 集成自成对齐的金属/六角化 (hBN) 门堆,以加强静电控制.
主要成果:
- 在等离子体兴奋剂的p-FET中证明了特殊的静电可控性.
- 实现了高的开/关电流比率和小的下值波动 (SS).
- 成功构建了一个采用新型设备架构的PMOS逆变器,显示出低功耗 (~4.5nW).
结论:
- 开发的方法有效地解决了制造高性能二维材料p-FETs的挑战.
- 具有选择性等离子体兴奋剂的自我调整的TG结构是未来低功耗电子设备的可行策略.
- 这项工作为基于2D材料的高级CMOS技术铺平了道路.
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